Skills
Below you can find the techniques and instruments I have hands-on experience with.
Nanofabrication
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Spinners to prepare thin films of polymers for UV and EBL lithography and for other uses. |
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Profilometer for measuring step heights or trench depths on a surface. Current instrument: Dektak XT Profilometer. Previously used instrument: Veeco Dektak-8. |
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Metal and thin-film evaporator. Current instrument: Sistec Evaporator. Ability to evaporate and lift-off Ni, Cr, Au, GeAu, Ti. |
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UV Lithography. Current instrument: Karl Suss MJB-4 mask aligner. |
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Wedge bonding of samples with semi-automatic digital wedge/wedge bonder. Current instrument: Kulicke & Soffa Digital Wedge Bonder (Model 4523D) for 1 mil Au or Al-wire. |
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Wet etching of nanostructured samples. Acid and basic solutions to etch samples at desired depths either selectively or non-selectively. |
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Dry etching of nanostructured samples: Inductively Coupled Plasma (ICP) Reactive-ion etching (RIE). Current instrument: Sentech ICP-RIE plasma etcher system equipped with Cl2, BCl3, N2 and Ar, used primarily for III-V semiconductor etching.. |
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Scanning Electron Microscope for imaging and Electron Beam Lithography (EBL). Current instrument: Carl Zeiss Ultra Plus and Carl Zeiss Merlin. Design software: Raith ELPHY MultiBeam and JC Nabity Nanometer Pattern Generation System. Previously used instrument: Leo Gemini SEM with Nabity design software. |
Optics
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Spinners to prepare thin films of polymers for UV and EBL lithography and for other uses. |
Low-T measurements
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Spinners to prepare thin films of polymers for UV and EBL lithography and for other uses. |
